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Samsung Galaxy S24 and S24+ attract attention with advanced design and features. It stands out with Armor Aluminum, Exynos 2400 processor, and built-in S Pen.

Nordic Semiconductor's nRF9161 DK development kit is an affordable solution for cellular IoT projects supporting LTE-M, NB-IoT, GNSS and DECT NR+ technologies

Zeiss is revolutionizing holographic solutions with its Multifunctional Smart Glass technology introduced at CES 2024.

Qualcomm's Snapdragon XR2+ Gen 2 processor delivers revolutionary performance and features in virtual reality.

Unitree B2: A standout competitor in high-performance robot, industrial automation and security applications. Advanced technology, strong battery life and impressive mobility.

Secure STM32H5 MCUs and Azure Cloud Connectivity: Learn about security and high-performance IoT solutions with the STM32Cube expansion pack

STM32 MCSDK 6.2: What's New and Fast Design - Learn about the latest version and new features of the STM32 Motor Control Development Kit

Wireless Technology and Training with STM32: Learn About MCU Selection, Applications and Training Process

nRF54L15 SoC: A wireless communications chip that breaks new ground in processing power, efficiency and security. Ideal for IoT and industrial applications

Bluetooth Networked Lighting Control (NLC) with the latest innovations in Bluetooth technology and the Bluetooth Mesh 1.1 specification

Neuralink Begins Recruitment for BCI in Human Clinical Trial - Innovative Brain-Computer Interface Research

Embodied AI: Learn about robot motion planning and machine learning

Join the sustainable technology webinar on September 19, 2023 and learn about the importance of smart sensors in energy efficiency

Automation with collaborative robots for flexible production. Increase your competitiveness with Universal Robots

Discover microcontroller security and security solutions of STM32Trust TEE Secure Manager.

Learn about unbrickable remote software updates and secure IoT development for STM32 MCUs.

Robert Bosch, Infineon and NXP Semiconductors, led by Taiwan Semiconductor Manufacturing Company (TSMC), are planning a major joint investment in European semiconductor manufacturing in Dresden. The factory, which will be equipped with advanced technologies, aims to meet the high demands of the automotive and industrial sectors.